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| A-70567-0090 |
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
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A-70567-0090 Datasheet
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A-70567-0090 и другие |
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| Компонент | Описание | Производитель | PDF |
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DDR II 0.6mm PITCH 200 POS STANDARD TYPE ASSY |
FCI connector |
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| 507-142Z209EB |
EMI/RFI Dual Entry Banding Backshell |
Glenair, Inc. |
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| 0025026022 |
2.54mm (.100") Pitch C-Grid^ Header, Dual Row, Shrouded, with PC Slot and Guide Ear, 22 Circuits, 0.38lm (15l") Gold (Au) Selective Plating |
Molex Electronics Ltd. |
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| 742792097 |
WE-CBF SMD EMI Suppression Ferrite Bead |
Wurth Elektronik GmbH & Co. KG, Germany. |
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| A-70567-0095 |
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
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