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| A-70567-0149 |
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, 0.76lm (30l) Gold (Au) Selective Plating |
Molex Electronics Ltd. |
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A-70567-0149 Datasheet
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Постоянная ссылка на эту страницу |
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A-70567-0149 и другие |
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| Компонент | Описание | Производитель | PDF |
| 380AA115NF14 |
EMI/RFI Non-Environmental Backshell with Strain Relief |
Glenair, Inc. |
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| A-70567-0154 |
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, 0.76lm (30l) Gold (Au) Selective Plating |
Molex Electronics Ltd. |
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| 7427927291 |
Multilayer-SMD-Ferrite |
Wurth Elektronik GmbH & Co. KG, Germany. |
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| 0026116145 |
3.96mm (.156") Pitch KK^ PC Board Connector, Top Entry, Nylon Connector, 1.0lm (40l") Tin (Sn), 14 Circuits |
Molex Electronics Ltd. |
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| 10034542-10025LF |
DDR II 240P PRESS-FIT |
FCI connector |
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