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| 7429FCT521DTPY |
MULTILEVEL PIPELINE REGISTERS |
Integrated Device Technology |
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7429FCT521DTPY Datasheet
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7429FCT521DTPY и другие |
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EMI/RFI Split Shell Banding Backshell |
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| A-70567-0349 |
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76lm (30l) Gold, (Au) Selective Plating |
Molex Electronics Ltd. |
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3V 1M‡8/512K‡16 CMOS Flash EEPROM |
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EMI/RFI Non-Environmental Backshell with Strain Relief |
Glenair, Inc. |
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| A-70567-0345 |
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
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