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| A-70568-0223 |
2.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
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A-70568-0223 Datasheet
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A-70568-0223 и другие |
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| Компонент | Описание | Производитель | PDF |
| 380AD013NF18 |
EMI/RFI Non-Environmental Backshell with Strain Relief |
Glenair, Inc. |
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| A-70575-0039 |
2.54mm (.100") Pitch SL Header, Single Row, Right Angle, .180" Pocket, Shrouded, with Press-fit Plastic Peg, 5 Circuits, 0.38lm (15l") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
Molex Electronics Ltd. |
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| AG-320240A1SIE |
SPECIFICATIONS FOR LCD MODULE |
List of Unclassifed Manufacturers |
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| 1N3826UR-1TR |
SILICON 1 WATT ZENER DIODES |
Microsemi Corporation |
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| 742X083120XP |
Chip Resistor Arrays |
CTS Corporation |
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