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| 74300-2155 |
2.00mm (.079") Pitch HDM^ Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, with Guide, 72 Circuits, Mounted Height 15.00mm (.512"), Press-Fit Pin Length |
Molex Electronics Ltd. |
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74300-2155 Datasheet
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Постоянная ссылка на эту страницу |
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74300-2155 и другие |
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| Компонент | Описание | Производитель | PDF |
| 74300-3155 |
2.00mm (.079") Pitch HDM^ Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, with Guide, 144 Circuits, Mounted Height 15.00mm (.591"), Press-Fit Pin |
Molex Electronics Ltd. |
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| 507-164C0905BB |
EMI/RFI Split Banding Micro-D Backshell Elliptical Entry |
Glenair, Inc. |
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| 0031.8323 |
Fuseholder Open Design, 5 x 20 mm, SMD, var. Covers, IEC 60335-1 |
Schurter Inc. |
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| A-70634-0041 |
2.54mm (.100) Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, .120 Pocket, Shrouded, with Press-fit Plastic Peg, 2 Circuits |
Molex Electronics Ltd. |
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| AS393 |
LOW POWER LOW OFFSET VOLTAGE DUAL COMPARATORS |
BCD Semiconductor Manufacturing Limited |
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