Audio applications

Ohmite Mfg. Co.

EMI/RFI Non-Environmental Backshell with Strain Relief

Glenair, Inc.

Fuseholder Open Design, 5 x 20 mm, SMD, var. Covers, IEC 60335-1

Schurter Inc.

MicroCross DVI Digital Single Link, High Volume Plug Connector Sub- assembly, ESD Type, 0.76lm (30l") Gold (Au) Plating, Vertical, with key, 18 Circuits, Lead Free

Molex Electronics Ltd.

2.54mm (.100) Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, .120 Pocket, Shrouded, with Press-fit Plastic Peg, 2 Circuits

Molex Electronics Ltd.

5.08mm (.200") Pitch KK^ Header, Vertical, Round Pin, 2 Circuits, Tin (Sn) Plating, Pin Length 19.05mm (.750")

Molex Electronics Ltd.