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Поиск Datasheets |
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| 447AW329XM16 |
Composite EMI/RFI Environmental Band-in-a-Can Backshell with Strain-Relief Clamp |
Glenair, Inc. |
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447AW329XM16 Datasheet
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Постоянная ссылка на эту страницу |
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447AW329XM16 и другие |
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| Компонент | Описание | Производитель | PDF |
| COP8SGC544N3 |
8-Bit CMOS ROM Based and OTP Microcontrollers with 8k to 32k Memory, Two Comparators and USART |
National Semiconductor |
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| C1206H124F4GACTU |
Surface Mount Ceramic Chip Capacitors High Temperature 200jC C0G MLCC |
Kemet Corporation |
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| C1206H124M1GACTU |
Surface Mount Ceramic Chip Capacitors High Temperature 200jC C0G MLCC |
Kemet Corporation |
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| 801-93-016-40-001 |
PCB connectors 2.54 mm Single row / double row / surface mount |
Precid-Dip Durtal SA |
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| C1206H124C1GACTU |
Surface Mount Ceramic Chip Capacitors High Temperature 200jC C0G MLCC |
Kemet Corporation |
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