0385 DATASHEET

Rundsteckverbinder mit Schraubverschluss nach IEC 60130-9 und AISG-Spezifikation, IP 40/IP 68

Lumberg

Rundsteckverbinder mit Schraubverschluss nach IEC 60130-9 und AISG-Spezifikation, IP 40/IP 68

Lumberg

10KV Digital High Voltage Insulation Tester

Extech Instruments Corporation.

In-Line PC1 and In-Line Sealed to IP66, PC1

Elektron Components Ltd.

FUSEHOLDERS

Elektron Components Ltd.

PLL Module

Advanced Semiconductor Business Inc.

MODULAR JACK, RJ45, SMT VERSION

Assmann Electronics Inc.

16-bit Proprietary Microcontroller CMOS

Fujitsu Component Limited.

Cascadable Silicon Bipolar MMIC Amplifier

Agilent(Hewlett-Packard)

DC-AC INVERTER UNIT 16 W QUAD OUTPUTS WITH DIMMING FUNCTION

Power Systems GmbH+Co.KG

Cascadable Silicon Bipolar MMIC Amplifier

Agilent(Hewlett-Packard)

Cascadable Silicon Bipolar MMIC Amplifier

Agilent(Hewlett-Packard)

2.54mm (.100") Pitch DIN 41612 Receptacle, Style C, 96 Circuits

Molex Electronics Ltd.

Krimptite Temp-Term Butt Splice for 14-16 AWG Wire, 483`C (900` F), Loose Piece

Molex Electronics Ltd.

2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, 0.76lm (30l") Gold (Au) Selective Plating

Molex Electronics Ltd.

0.50mm Pitch Premo-Flex FFC Jumper, Same Side Contacts (Type A), 36 Circuits

Molex Electronics Ltd.

Extractor Tool Instruction Sheet

Molex Electronics Ltd.

Krimptite Temp-Term Butt Splice for 14-16 AWG Wire, 483`C (900` F), Loose Piece

Molex Electronics Ltd.

1.00mm (.039") Pitch FFC/FPC Connector, SMT, Right Angle, ZIF, Top Contact StyleReceptacle, 3 Circuits, Lead-free, High Barrier Packaging

Molex Electronics Ltd.

1.00mm (.039") Pitch FFC/FPC Connector, SMT, Right Angle, ZIF, Top Contact StyleReceptacle, 3 Circuits, Lead-free, High Barrier Packaging

Molex Electronics Ltd.

2.54mm (.100) Pitch DIN 41612 Header, Style B, Right Angle, Through Hole, 0.6lm (24l) Selective Gold (Au), 64 Circuits

Molex Electronics Ltd.