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Компонент | Описание | Производитель | PDF | Buy |
21-0664 | PACKAGE OUTLINE 12L TDFN, 3*3*0.75MM | Maxim Integrated Products | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
2SK0664 | For Switching | Panasonic Semiconductor | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
35.0664 | LFM (with T1 LED) | Schurter Inc. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
ASI10664 | UHF POWER MOSFET N-Channel Enhancement Mode | Advanced Semiconductor | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
EP120664 | 7 Pin Single-in-Line Package Passive Delay Lines | PCA ELECTRONICS INC. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
ADC10664 | 10-Bit 360 ns A/D Converter with Input Multiplexer and Sample/Hold | National Semiconductor | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
0035.0664 | LFM (with T1 LED) | Schurter Inc. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
HT46R0664 | Enhanced A/DLCD Type 8-Bit OTP MCU | Holtek Semiconductor Inc | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
75331-0664 | 1.85mm by 1.85mm (.073 by .073") Pitch 3-Pair GbX Backplane Connector System, Power Module | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
0753310664 | 1.85mm by 1.85mm (.073 by .073") Pitch 3-Pair GbX Backplane Connector System, Power Module | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
0873810664 | 2.00mm (.079) Pitch Milli-Grid Receptacle, Surface Mount, Top Entry, 0.38lm (15l) Gold (Au) Plating, with Cap, without Locating Pegs, 6 Circuits, Lead-free | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
0877590664 | 2.00mm (.079") Pitch Milli-Grid Header, Surface Mount, Vertical, 6 Circuits | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
87381-0664 | 2.00mm (.079) Pitch Milli-Grid Receptacle, Surface Mount, Top Entry, 0.38lm (15l) Gold (Au) Plating, with Cap, without Locating Pegs, 6 Circuits, Lead-free | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
87759-0664 | 2.00mm (.079") Pitch Milli-Grid Header, Surface Mount, Vertical, 6 Circuits | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
192991-0664 | Cannon Trident Connector System Neptune Circular Connectors | ITT Industries | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
S10664-01 | Transmitter/Receiver photo IC for optical link 3.3 V operation, for MOST automotive network | Hamamatsu Corporation | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
DBCHJ0664-3RT | AUDIO PCB 6.4 HEADPHONE JACK | Dubilier | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
DBCHJ0664-3TS | AUDIO PCB 6.4 HEADPHONE JACK | Dubilier | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
DBCHJ0664-4SS | AUDIO PCB 6.4 HEADPHONE JACK | Dubilier | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
DBCHJ0664-6 | AUDIO PCB 6.4 HEADPHONE JACK | Dubilier | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
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