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| Результаты поиска для 50084 | |
| Компонент | Описание | Производитель | PDF | Buy |
| SI-50084 | SI-50084 | Bel Fuse Inc. |  |  |
| 0705450084 | 2.54mm (.100") Pitch SL Header, Single Row .120" Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 15 Circuits, 0.76lm (30l") Gold (Au) Selective Plating, Tin (Sn) | Molex Electronics Ltd. | | |
| 0705550084 | 2.54mm (.100") Pitch SL Header, Single Row, Right Angle, .120" Pocket, Shrouded, with Press-fit Plastic Peg | Molex Electronics Ltd. | | |
| 0705750084 | 2.54mm (.100") Pitch SL Header, Single Row, Right Angle, .180" Pocket, Shroudedwith Press-fit Plastic Peg, 15 Circuits, 0.76lm (30l") Gold (Au) Selective Plating, Tin | Molex Electronics Ltd. | | |
| PM-V050084 | VERSA-PAC INDUCTORS & TRANSFORMERS | Premier Magnetics, Inc. | | |
| 650084-000 | STUB SPLICE SEALING SYSTEM MULTI-WIRE | PANDUIT CORP. | | |
| K4Y50084UC | 512Mbit XDR TM DRAM(C-die) | Samsung semiconductor | | |
| K4Y50084UC-JC | XDRTM DRAM Product Guide | Samsung semiconductor | | |
| K4Y50084UC-JCA2 | 512Mbit XDR TM DRAM(C-die) | Samsung semiconductor | | |
| K4Y50084UC-JCB3 | 512Mbit XDR TM DRAM(C-die) | Samsung semiconductor | | |
| K4Y50084UC-JCC4 | 512Mbit XDR TM DRAM(C-die) | Samsung semiconductor | | |
| K4Y50084UE-JC | XDRTM DRAM Product Guide | Samsung semiconductor | | |
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