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| Результаты поиска для 527-1 | |
| Компонент | Описание | Производитель | PDF | Buy |
| 1N5527-1 | LEADLESS PACKAGE FOR SURFACE MOUNT ZENER DIODE, 500mW | Microsemi Corporation |  |  |
| HT7527-1 | 100mA Low Power LDO | Holtek Semiconductor Inc | | |
| SOT527-1 | Package outline | NXP Semiconductors | | |
| 1903527-1 | RJ 45 CONNECTOR INDUSTRIAL ETHERNET 1P20 8POS 180DEG STRD WIRE | Tyco Electronics | | |
| JAN1N5527-1 | LEADLESS PACKAGE FOR SURFACE MOUNT ZENER DIODE, 500mW | Microsemi Corporation | | |
| JANTX1N5527-1 | LEADLESS PACKAGE FOR SURFACE MOUNT ZENER DIODE, 500mW | Microsemi Corporation | | |
| JANTXV1N5527-1 | LEADLESS PACKAGE FOR SURFACE MOUNT ZENER DIODE, 500mW | Microsemi Corporation | | |
| 35527-1015 | 6.35mm (.250") Pitch, Wire-to-Wire Housing, Female 10 Circuits | Molex Electronics Ltd. | | |
| 527-108 | EMI/RFI Banding Backshell | Glenair, Inc. | | |
| 527-108BP | EMI/RFI Banding Backshell | Glenair, Inc. | | |
| 527-108BP1 | EMI/RFI Banding Backshell | Glenair, Inc. | | |
| 527-108BP2 | EMI/RFI Banding Backshell | Glenair, Inc. | | |
| 527-108BP3 | EMI/RFI Banding Backshell | Glenair, Inc. | | |
| 527-108BP5 | EMI/RFI Banding Backshell | Glenair, Inc. | | |
| 527-108BP6 | EMI/RFI Banding Backshell | Glenair, Inc. | | |
| 527-108CP | EMI/RFI Banding Backshell | Glenair, Inc. | | |
| 527-108CP1 | EMI/RFI Banding Backshell | Glenair, Inc. | | |
| 527-108CP2 | EMI/RFI Banding Backshell | Glenair, Inc. | | |
| 527-108CP3 | EMI/RFI Banding Backshell | Glenair, Inc. | | |
| 527-108CP5 | EMI/RFI Banding Backshell | Glenair, Inc. | | |
Поиск занял 0.0346 сек.
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