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![](/forums/images/ca_evo_db/misc/spacer.gif) | Результаты поиска для LE82GM965 | ![](/forums/images/ca_evo_db/misc/spacer.gif) |
Компонент | Описание | Производитель | PDF | Buy |
NX8564LE820-BC | NECs EA MODULATOR INTEGRATED InGaAsP MQW DFB LASER DIODE MODULE FOR 2.5 Gb/s ULTRALONG-REACH 360, 600, 240 km DWDM APPLICATIONS | California Eastern Labs | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
NX8565LE820-BC | NECs EA MODULATOR INTEGRATED InGaAsP MQW DFB LASER DIODE MODULE FOR 2.5 Gb/s ULTRALONG-REACH 360, 600, 240 km DWDM APPLICATIONS | California Eastern Labs | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
NX8566LE820-BC | NECs EA MODULATOR INTEGRATED InGaAsP MQW DFB LASER DIODE MODULE FOR 2.5 Gb/s ULTRALONG-REACH 360, 600, 240 km DWDM APPLICATIONS | California Eastern Labs | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
NX8564LE820-CC | NECs EA MODULATOR INTEGRATED InGaAsP MQW DFB LASER DIODE MODULE FOR 2.5 Gb/s ULTRALONG-REACH 360, 600, 240 km DWDM APPLICATIONS | California Eastern Labs | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
NX8565LE820-CC | NECs EA MODULATOR INTEGRATED InGaAsP MQW DFB LASER DIODE MODULE FOR 2.5 Gb/s ULTRALONG-REACH 360, 600, 240 km DWDM APPLICATIONS | California Eastern Labs | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
NX8566LE820-CC | NECs EA MODULATOR INTEGRATED InGaAsP MQW DFB LASER DIODE MODULE FOR 2.5 Gb/s ULTRALONG-REACH 360, 600, 240 km DWDM APPLICATIONS | California Eastern Labs | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
TLE8201R | Door Module Power IC | Infineon Technologies AG | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
TLE8203E | Mirror Power IC | Infineon Technologies AG | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
TLE8209-2SA | SPI Programmable H-Bridge | Infineon Technologies AG | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
TLE8242-2 | 8 Channel Fixed Frequency Constant Current Control With Current Profile Detection | Infineon Technologies AG | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
TLE8250G | High Speed CAN-Transceiver | Infineon Technologies AG | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
TLE8250GVIO | High Speed CAN-Transceiver | Infineon Technologies AG | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
TLE8261-2E | Universal System Basis Chip | Infineon Technologies AG | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
TLE8261E | Universal System Basis Chip HERMES Rev. 1.0 | Infineon Technologies AG | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
TLE8262-2E | Universal System Basis Chip | Infineon Technologies AG | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
TLE8262E | Universal System Basis Chip HERMES Rev. 1.0 | Infineon Technologies AG | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
TLE8263-2E | Universal System Basis Chip | Infineon Technologies AG | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
TLE8263E | Universal System Basis Chip HERMES Rev. 1.0 | Infineon Technologies AG | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
TLE8264-2E | Universal System Basis Chip | Infineon Technologies AG | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
TLE8264E | Universal System Basis Chip HERMES Rev. 1.0 | Infineon Technologies AG | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
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