| Компонент | Описание | Производитель | PDF | Buy |
| LDB211G6005C-001 | Chip Multilayer Hybrid Baluns | Murata Manufacturing Co., Ltd. |  |  |
| LDB211G6010C-001 | Chip Multilayer Hybrid Baluns | Murata Manufacturing Co., Ltd. | | |
| LDB211G6020C-001 | Chip Multilayer Hybrid Baluns | Murata Manufacturing Co., Ltd. | | |
| LDB211G8005C-001 | Chip Multilayer Hybrid Baluns | Murata Manufacturing Co., Ltd. | | |
| LDB211G8010C-001 | Chip Multilayer Hybrid Baluns | Murata Manufacturing Co., Ltd. | | |
| LDB211G8020C-001 | Chip Multilayer Hybrid Baluns | Murata Manufacturing Co., Ltd. | | |
| LDB211G9005C-001 | Chip Multilayer Hybrid Baluns | Murata Manufacturing Co., Ltd. | | |
| LDB211G9010C-001 | Chip Multilayer Hybrid Baluns | Murata Manufacturing Co., Ltd. | | |
| LDB211G9020C-001 | Chip Multilayer Hybrid Baluns | Murata Manufacturing Co., Ltd. | | |
| LDB212G4005C-001 | Chip Multilayer Hybrid Baluns | Murata Manufacturing Co., Ltd. | | |
| LDB212G4010C-001 | Chip Multilayer Hybrid Baluns | Murata Manufacturing Co., Ltd. | | |
| LDB212G4020C-001 | Chip Multilayer Hybrid Baluns | Murata Manufacturing Co., Ltd. | | |
| DB2130300L | Embossed type (Thermo-compression sealing) : 3 000 pcs / reel (standard) | Panasonic Battery Group | | |
| DB2141200L | Embossed type (Thermo-compression sealing) : 3 000 pcs / reel (standard) | Panasonic Battery Group | | |
| DB21413 | Silicon epitaxial planar type | Panasonic Semiconductor | | |
| HMC-MDB218 | GaAs MMIC SUB-HARMONIC IRM MIXER, 54 - 64 GHz | Hittite Microwave Corporation | | |
| HMC-MDB218 | GaAs MMIC SUB-HARMONIC IRM MIXER, 54 - 64 GHz | Hittite Microwave Corporation | | |
| LDB21836M20C-001 | Chip Multilayer Hybrid Baluns | Murata Manufacturing Co., Ltd. | | |
| LDB21881M05C-001 | Chip Multilayer Hybrid Baluns | Murata Manufacturing Co., Ltd. | | |
| LDB21881M20C-001 | Chip Multilayer Hybrid Baluns | Murata Manufacturing Co., Ltd. | | |
