Результаты поиска для 0664TT1E5SNB

PACKAGE OUTLINE 12L TDFN, 3*3*0.75MM

Maxim Integrated Products

For Switching

Panasonic Semiconductor

LFM (with T1 LED)

Schurter Inc.

UHF POWER MOSFET N-Channel Enhancement Mode

Advanced Semiconductor

7 Pin Single-in-Line Package Passive Delay Lines

PCA ELECTRONICS INC.

10-Bit 360 ns A/D Converter with Input Multiplexer and Sample/Hold

National Semiconductor

LFM (with T1 LED)

Schurter Inc.

Enhanced A/DLCD Type 8-Bit OTP MCU

Holtek Semiconductor Inc

1.85mm by 1.85mm (.073 by .073") Pitch 3-Pair GbX Backplane Connector System, Power Module

Molex Electronics Ltd.

1.85mm by 1.85mm (.073 by .073") Pitch 3-Pair GbX Backplane Connector System, Power Module

Molex Electronics Ltd.

2.00mm (.079) Pitch Milli-Grid Receptacle, Surface Mount, Top Entry, 0.38lm (15l) Gold (Au) Plating, with Cap, without Locating Pegs, 6 Circuits, Lead-free

Molex Electronics Ltd.

2.00mm (.079") Pitch Milli-Grid Header, Surface Mount, Vertical, 6 Circuits

Molex Electronics Ltd.

2.00mm (.079) Pitch Milli-Grid Receptacle, Surface Mount, Top Entry, 0.38lm (15l) Gold (Au) Plating, with Cap, without Locating Pegs, 6 Circuits, Lead-free

Molex Electronics Ltd.

2.00mm (.079") Pitch Milli-Grid Header, Surface Mount, Vertical, 6 Circuits

Molex Electronics Ltd.

Cannon Trident Connector System Neptune Circular Connectors

ITT Industries

Transmitter/Receiver photo IC for optical link 3.3 V operation, for MOST automotive network

Hamamatsu Corporation

AUDIO PCB 6.4 HEADPHONE JACK

Dubilier

AUDIO PCB 6.4 HEADPHONE JACK

Dubilier

AUDIO PCB 6.4 HEADPHONE JACK

Dubilier

AUDIO PCB 6.4 HEADPHONE JACK

Dubilier