| Компонент | Описание | Производитель | PDF | Buy |
| 2-106527-0 | AMP-DUAC (TM) RECEPTACLE HOUSING, 2 TO 24 POSITION | Tyco Electronics |  |  |
| 215-527-00-50 | Direct replacement for T3 l Bayonet Automobile Cap | Marl International Limited | | |
| D12527-000 | Metal Oxide Varistors Overvoltage Protection Device | Tyco Electronics | | |
| 025-9527-000 | Micro-D Metal Shell - .050" Contact Spacing | ITT Industries | | |
| 051527-0000 | D*M High reliable D-Sub Connectors | ITT Industries | | |
| 051527-0006 | Combo D Series: D-Subminiature offering mixed layouts | ITT Industries | | |
| SD-501527-001 | 0.40mm (.016") Pitch SlimStack Board-to-Board Receptacle, SMT, Dual Row, Vertical, 1.30mm | Molex Electronics Ltd. | | |
| SD-501527-001 | 0.40mm (.016") Pitch SlimStack Board-to-Board Receptacle, SMT, Dual Row,Vertical, 1.30mm (.051") Stacking Height | Molex Electronics Ltd. | | |
| SD-501527-001 | 0.40mm (.016") Pitch SlimStack Board-to-Board Receptacle, SMT, Dual Row, Vertical, 1.30mm (.051") Stacking Height | Molex Electronics Ltd. | | |
| SD-501527-002 | 0.40mm (.016") Pitch SlimStack Board-to-Board Receptacle, SMT, Dual Row, Vertical, 1.30mm | Molex Electronics Ltd. | | |
| SD-501527-002 | 0.40mm (.016") Pitch SlimStack Board-to-Board Receptacle, SMT, Dual Row,Vertical, 1.30mm (.051") Stacking Height | Molex Electronics Ltd. | | |
| SD-501527-002 | 0.40mm (.016") Pitch SlimStack Board-to-Board Receptacle, SMT, Dual Row, Vertical, 1.30mm (.051") Stacking Height | Molex Electronics Ltd. | | |
| SD-501527-003 | 0.40mm (.016") Pitch SlimStack Board-to-Board Receptacle, SMT, Dual Row, Vertical, 1.30mm (.051") | Molex Electronics Ltd. | | |
| SD-501527-004 | 0.40mm (.016") Pitch SlimStack Board-to-Board Receptacle, SMT, Dual Row, Vertical, 1.30mm (.051") | Molex Electronics Ltd. | | |
| ICS527-01 | Clock Slicer User Configurable Zero Delay Buffer | Integrated Circuit Systems | | |
| 2SK3527-01 | N-CHANNEL SILICON POWER MOSFET | Fuji Electric | | |
| 2SK3527-01 | N-CHANNEL SILICON POWER MOSFET | Fuji Electric | | |
| MGFS38E2527-01 | 2.5 - 2.7GHz HBT MMIC MODULE | Mitsubishi Electric Semiconductor | | |
| 527-015B01 | Solid Strain-Relief Backshell | Glenair, Inc. | | |
| 527-015B02 | Solid Strain-Relief Backshell | Glenair, Inc. | | |
