Результаты поиска для 56412

1.27mm (.050"), 12.00mm (.472") Pitch, EXTreme LPHPower Header, Right Angle, 6Power Contacts, 12 Signal Contacts, Select Gold (Au) Plating, for 2.36mm (.093") Thick

Molex Electronics Ltd.

Logic level four-quadrant triac

NXP Semiconductors

RELAY WITH PROPORTIONAL CONTROL

celduc-relais

2.54mm (.100") Pitch SL Insulation Displacement Connector Assembly, Female, Single Row, Version C, Front Ribs, Wire Size 24, 0.76lm (30l") Gold (Au), 12 Circuits

Molex Electronics Ltd.

2.54mm (.100") Pitch SL Insulation Displacement Connector Assembly, Female,Single Row, Version D, Back Ribs, Wire Size 24, 0.76lm (30l") Gold (Au), 12 Circuits

Molex Electronics Ltd.

2.54mm (.100") Pitch SL Insulation Displacement Connector Assembly, Female, Single Row, Version C, Front Ribs, Wire Size 26, 0.76lm (30l") Gold (Au), 12 Circuits

Molex Electronics Ltd.

2.54mm (.100") Pitch SL Insulation Displacement Connector Assembly, Female,Single Row, Version D, Back Ribs, Wire Size 26, 0.76lm (30l") Gold (Au), 12 Circuits

Molex Electronics Ltd.

The 2.5 mm wide ultra-slim body contributes to further contributes to further enhancement of target equipment.

Panasonic Semiconductor

NARROW-PITCH, THIN AND SLIM CONNECTOR FOR BOARD-TO-FPC CONNECTION

Panasonic Semiconductor

2.54mm (.100") Pitch SL Insulation Displacement Connector Assembly, Female, Single Row, Version C, Front Ribs, Wire Size 28, 0.76lm (30l") Gold (Au), 12 Circuits

Molex Electronics Ltd.

2.54mm (.100") Pitch SL Insulation Displacement Connector Assembly, Female,Single Row, Version D, Back Ribs, Wire Size 28, 0.76lm (30l") Gold (Au), 12 Circuits

Molex Electronics Ltd.