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| 568-0203-232 DATASHEET | |
| Компонент | Описание | Производитель | PDF | Buy |
568-0203-232 | 3mm LED CBI Circuit Board Indicator Quad-Level | Dialight Corporation |  |  |
| *568-020*: Расширенные результаты | |
| Компонент | Описание | Производитель | PDF | Buy |
| A-70568-0200 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
| A-70568-0201 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
| 568-0201-111 | 3mm LED CBI Circuit Board Indicator Quad-Level | Dialight Corporation | | |
| 568-0201-111 | 3mm LED CBI Circuit Board Indicator QUAD-LEVEL | Dialight Corporation | | |
| A-70568-0202 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
| 568-0202-222 | 3mm LED CBI Circuit Board Indicator QUAD-LEVEL | Dialight Corporation | | |
| 568-0202-222 | 3mm LED CBI Circuit Board Indicator Quad-Level | Dialight Corporation | | |
| 568-0202-323 | 3mm LED CBI Circuit Board Indicator Quad-Level | Dialight Corporation | | |
| 568-0202-323 | 3mm LED CBI Circuit Board Indicator QUAD-LEVEL | Dialight Corporation | | |
| A-70568-0203 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
| 568-0203-232 | 3mm LED CBI Circuit Board Indicator Quad-Level | Dialight Corporation | | |
| 568-0203-232 | 3mm LED CBI Circuit Board Indicator QUAD-LEVEL | Dialight Corporation | | |
| A-70568-0204 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
| A-70568-0205 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
| A-70568-0206 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
| 501568-0207 | 1.00mm (.039") Pitch Pico-Clasp Wire-to-Board Header, Surface Mount, Single Row, Right Angle, with Friction Lock | Molex Electronics Ltd. | | |
| 501568-0207 | 1.0 WIRE TO BOARD CONN. 1-ROW R/A WAFER ASSY 2-5CKT -LEAD FREE- | Molex Electronics Ltd. | | |
| A-70568-0207 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
| A-70568-0208 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
| 501568-0209 | 1.0 WIRE TO BOARD CONN. 1-ROW R/A WAFER ASSY 2-5CKT -LEAD FREE- | Molex Electronics Ltd. | | |
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