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| 7914G1000 DATASHEET | |
| Компонент | Описание | Производитель | PDF | Buy |
7914G | BOOSTXL-SENSHUB Sensor Hub BoosterPack | Texas Instruments |  |  |
| *7914*: Расширенные результаты | |
| Компонент | Описание | Производитель | PDF | Buy |
| 7914 | 4 mm SMD & Through-hole Sealed Key Switch | Bourns Electronic Solutions | | |
| 7914 | SMD & Through-hole Sealed Key Switch | Bourns Electronic Solutions | | |
| AD7914 | 4-Channel, 1 MSPS, 8-/10-/12-Bit ADCs with Sequencer in 16-Lead TSSOP | Analog Devices | | |
| 1107914 | tyco electronics contents | Tyco Electronics | | |
| EUP7914 | 150mA Low-Noise LDO in SC-82 Without A Bypass Capacitor | Eutech Microelectronics Inc | | |
| IDT77914 | NICStAR Reference Design 155Mbps Network Interface Card NIC | Integrated Device Technology | | |
| 87914-0009 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row, Vertical, 6 Circuits, Gold (Au) Flash Overall Plating, Tray Packaging, Lead-free | Molex Electronics Ltd. | | |
| 87914-0216 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row, Vertical, 2 Circuits, 2.50lm (98.4l) Tin (Sn) Overall Plating, Tray Packaging, Lead-free | Molex Electronics Ltd. | | |
| 87914-0616 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row, Vertical, 6 Circuits, 2.50lm (98.4l) Tin (Sn) Overall Plating, Tray Packaging, Lead-free | Molex Electronics Ltd. | | |
| 87914-0806 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row, Vertical, 8 Circuits, 2.54lm (100l) Tin (Sn) Overall Plating, Tray Packaging, Lead-free | Molex Electronics Ltd. | | |
| 87914-0807 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row, Vertical, 8 Circuits, 2.54lm (100l) Tin (Sn) Overall Plating, Tray Packaging | Molex Electronics Ltd. | | |
| 87914-0816 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row, Vertical, 8 Circuits, 2.50lm (98.4l) Tin (Sn) Overall Plating, Tray Packaging, Lead-free | Molex Electronics Ltd. | | |
| 87914-1016 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row, Vertical, 10 Circuits, 2.50lm (98.4l) Tin (Sn) Overall Plating, Tray Packaging, Lead-free | Molex Electronics Ltd. | | |
| 87914-1216 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row, Vertical, 12 Circuits, 2.50lm (98.4l) Tin (Sn) Overall Plating, Tray Packaging, Lead-free | Molex Electronics Ltd. | | |
| EUP7914-12NIR1 | 150mA Low-Noise LDO in SC-82 Without A Bypass Capacitor | Eutech Microelectronics Inc | | |
| 87914-1416 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row, Vertical, 14 Circuits, 2.50lm (98.4l) Tin (Sn) Overall Plating, Tray Packaging, Lead-free | Molex Electronics Ltd. | | |
| EUP7914-15NIR1 | 150mA Low-Noise LDO in SC-82 Without A Bypass Capacitor | Eutech Microelectronics Inc | | |
| 87914-1616 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row, Vertical, 16 Circuits, 2.50lm (98.4l) Tin (Sn) Overall Plating, Tray Packaging, Lead-free | Molex Electronics Ltd. | | |
| 87914-1816 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row, Vertical, 18 Circuits, 2.50lm (98.4l) Tin (Sn) Overall Plating, Tray Packaging, Lead-free | Molex Electronics Ltd. | | |
| EUP7914-18NIR1 | 150mA Low-Noise LDO in SC-82 Without A Bypass Capacitor | Eutech Microelectronics Inc | | |
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