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| 8974 DATASHEET | |
| Компонент | Описание | Производитель | PDF | Buy |
8974 | RF Amplifier | Communications & Power Industries, Inc. |  |  |
| *8974*: Расширенные результаты | |
| Компонент | Описание | Производитель | PDF | Buy |
| 8974 | RF Amplifier | Communications & Power Industries, Inc. | | |
| 028974 | A solid moulded core with soft outer grip, less force, yet achieves 40% more torque | List of Unclassifed Manufacturers | | |
| WM8974 | MONO CODEC WITH SPEAKER DRIVER | Wolfson Microelectronics plc | | |
| 0010897400 | 2.54mm (.100") Pitch C-Grid^ Breakaway Header, Dual Row, Vertical, High Temperature, 40 Circuits, 0.76lm (30l") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107") PC Tail | Molex Electronics Ltd. | | |
| 5962-8974001RA | High-Speed CMOS Logic Octal Three-State Bus Transceiver, Inverting | Texas Instruments | | |
| 5962-8974001RA | High-Speed CMOS Logic Octal Three-State Bus Transceiver, Inverting | Texas Instruments | | |
| 0010897401 | 2.54mm (.100") Pitch C-Grid^ Breakaway Header, Dual Row, Vertical, High Temperature, 40 Circuits, Tin (Sn) Plating, 2.72mm (.107") PC Tail Length | Molex Electronics Ltd. | | |
| 0010897402 | 2.54mm (.100") Pitch C-Grid^ Breakaway Header, Dual Row, Vertical, High Temperature, 40 Circuits, 0.38lm (15l") Gold (Au) Selective Plating | Molex Electronics Ltd. | | |
| 223897411447 | Surface mount ceramic multilayer capacitors | NXP Semiconductors | | |
| 223897411461 | Surface mount ceramic multilayer capacitors | NXP Semiconductors | | |
| 223897411547 | Surface mount ceramic multilayer capacitors | NXP Semiconductors | | |
| 223897411561 | Surface mount ceramic multilayer capacitors | NXP Semiconductors | | |
| 0010897420 | 2.54mm (.100") Pitch C-Grid^ Breakaway Header, Dual Row, Vertical, High Temperature, 42 Circuits, 0.76lm (30l") Gold (Au) Selective Plating | Molex Electronics Ltd. | | |
| 0010897421 | 2.54mm (.100") Pitch C-Grid^ Breakaway Header, Dual Row, Vertical, High Temperature, 42 Circuits, Tin (Sn) Plating, 2.72mm (.107") PC Tail Length | Molex Electronics Ltd. | | |
| 0010897422 | 2.54mm (.100") Pitch C-Grid^ Breakaway Header, Dual Row, Vertical, HighTemperature, 42 Circuits, 0.38lm (15l") Gold (Au) Selective Plating, Tin (Sn) PC TailPlating | Molex Electronics Ltd. | | |
| 5962-8974301EA | High-Speed CMOS Logic Hex D-Type Flip-Flop with Reset | Texas Instruments | | |
| 0010897440 | 2.54mm (.100") Pitch C-Grid^ Breakaway Header, Dual Row, Vertical, High Temperature, 44 Circuits, 0.76lm (30l") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107") PC Tail | Molex Electronics Ltd. | | |
| 0010897441 | 2.54mm (.100") Pitch C-Grid^ Breakaway Header, Dual Row, Vertical, High Temperature, 44 Circuits, Tin (Sn) Plating, 2.72mm (.107") PC Tail Length | Molex Electronics Ltd. | | |
| 0010897442 | 2.54mm (.100") Pitch C-Grid^ Breakaway Header, Dual Row | Molex Electronics Ltd. | | |
| 223897451447 | Surface mount ceramic multilayer capacitors | NXP Semiconductors | | |
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