| Компонент | Описание | Производитель | PDF | Buy |
| C1318 | Rubber/PVC/Polyethylene | General Cable Technologies Corporation |  |  |
| C1318 | TEST LEAD WIRE | General Cable Technologies Corporation | | |
| 2SC1318 | Silicon NPN epitaxial planer type(For low-frequency power amplification and driver amplification) | Panasonic Semiconductor | | |
| 2SC1318 | NPN Plastic Encapsulated Transistor | SeCoS Halbleitertechnologie GmbH | | |
| LTC1318 | Single 5V RS232/RS422/AppleTalk DCE Transceiver | Linear Technology | | |
| 307C1318 | PTCR Overcurrent Protection | Vishay Siliconix | | |
| HC13180 | Breake Away Header .025(0.64mm) Square Posts | List of Unclassifed Manufacturers | | |
| MC13180 | 2.4 GHz Low Power Wireless Transceiver IC for Bluetooth Applications | Motorola, Inc | | |
| PC13180FC | 2.4 GHz Low Power Wireless Transceiver IC for Bluetooth Applications | Motorola, Inc | | |
| HC13181 | Breake Away Header .025(0.64mm) Square Posts | List of Unclassifed Manufacturers | | |
| MC13181 | Wireless Power Management Integrated Circuit | Motorola, Inc | | |
| MC13181R2 | Wireless Power Management Integrated Circuit | Motorola, Inc | | |
| HC13183 | Breake Away Header .025(0.64mm) Square Posts | List of Unclassifed Manufacturers | | |
| HC13187 | Breake Away Header .025(0.64mm) Square Posts | List of Unclassifed Manufacturers | | |
| 2SC1318A | Silicon NPN epitaxial planer type(For low-frequency driver amplification) | Panasonic Semiconductor | | |
| 2SC1318A | NPN Plastic Encapsulated Transistor | SeCoS Halbleitertechnologie GmbH | | |
| CY7C1318AV18 | 18-Mbit DDR-II SRAM 2-Word Burst Architecture | Cypress Semiconductor | | |
| CY7C1318AV18-167BZC | 18-Mbit DDR-II SRAM 2-Word Burst Architecture | Cypress Semiconductor | | |
| CY7C1318AV18-200BZC | 18-Mbit DDR-II SRAM 2-Word Burst Architecture | Cypress Semiconductor | | |
| CY7C1318AV18-250BZC | 18-Mbit DDR-II SRAM 2-Word Burst Architecture | Cypress Semiconductor | | |
