| Компонент | Описание | Производитель | PDF | Buy |
| DSA010 | Stabkerndrosseln Iron core chokes Selfs baton de fer | Eichhoff Electronics,Inc. |  |  |
| DSA015 | Silicon epitaxial planar type, high-speed switching diode | Sanyo Semicon Device | | |
| PN21LDSA03QE | Alternate & Momentary Action Pushbutton Switches | ITT Industries | | |
| PN21LDSA03QE | Alternate & Momentary Action Pushbutton Switches | C&K Components | | |
| PN21SDSA03QE | Alternate & Momentary Action Pushbutton Switches | C&K Components | | |
| PN21SDSA03QE | Alternate & Momentary Action Pushbutton Switches | ITT Industries | | |
| GT9-12S-2.54DSA05 | Developed for Equipment Exposed to Harsh Environmental Conditions | Hirose Electric | | |
| GT9-16S-2.54DSA05 | Developed for Equipment Exposed to Harsh Environmental Conditions | Hirose Electric | | |
| GT9-19S-2.54DSA05 | Developed for Equipment Exposed to Harsh Environmental Conditions | Hirose Electric | | |
| GT9-18S-2.54DSA05 | Developed for Equipment Exposed to Harsh Environmental Conditions | Hirose Electric | | |
| GT9-24D-2.54DSA05 | Developed for Equipment Exposed to Harsh Environmental Conditions | Hirose Electric | | |
| GT9-25S-2.54DSA05 | Developed for Equipment Exposed to Harsh Environmental Conditions | Hirose Electric | | |
| GT9-15S-2.54DSA05 | Developed for Equipment Exposed to Harsh Environmental Conditions | Hirose Electric | | |
| GT9-30D-2.54DSA05 | Developed for Equipment Exposed to Harsh Environmental Conditions | Hirose Electric | | |
| GT9P-16P-2.54DSA05 | Developed for Equipment Exposed to Harsh Environmental Conditions | Hirose Electric | | |
| GT9P-19P-2.54DSA05 | Developed for Equipment Exposed to Harsh Environmental Conditions | Hirose Electric | | |
| GT9P-25P-2.54DSA05 | Developed for Equipment Exposed to Harsh Environmental Conditions | Hirose Electric | | |
| GT9P-12P-2.54DSA05 | Developed for Equipment Exposed to Harsh Environmental Conditions | Hirose Electric | | |
| PM200DSA060 | USING INTELLIGENT POWER MODULES | Mitsubishi Electric Semiconductor | | |
| PM200DSA060 | FLAT-BASE TYPE INSULATED PACKAGE | Mitsubishi Electric Semiconductor | | |
