| Компонент | Описание | Производитель | PDF | Buy |
| LLDB3 | SILICON BIDIRECTIONAL DIAC | Jinan Jingheng (Group) Co.,Ltd |  |  |
| LLDB3 | 150mW Bi-directional Trigger Diode | Taiwan Semiconductor Company, Ltd | | |
| LLDB3 | SILICON BIDIRECTIONAL DIAC | Micro Commercial Components | | |
| LLDB3 | LL-34 Hermetically Sealed Glass BI-directional Trigger Diode | Tak Cheong Electronics Holdings Co.,Ltd | | |
| LLDB3 | SILICON BIDIRECTIONAL DIAC | Gaomi Xinghe Electronics Co., Ltd. | | |
| LLDB3 | DIAC | Formosa MS | | |
| LLDB3 | SILICON BIDIRECTIONAL DIACS | SEMTECH ELECTRONICS LTD. | | |
| LLDB3 | TRIGGER DIODES | Rectron Semiconductor | | |
| MCLDB3 | SILICON BIDIRECTIONAL DIAC | Jinan Jingheng (Group) Co.,Ltd | | |
| KELDB3 | DO-35 Hermetically Sealed Glass BI-directional Trigger Diode | Tak Cheong Electronics Holdings Co.,Ltd | | |
| CLLDB3 | SILICON DIAC BIDIRECTIONAL TRIGGER DIODE GLASS PASSIVATED PNPN DEVICE | Continental Device India Limited | | |
| LDB311G5005C-300 | Chip Multilayer Hybrid Baluns | Murata Manufacturing Co., Ltd. | | |
| LDB311G5010C-300 | Chip Multilayer Hybrid Baluns | Murata Manufacturing Co., Ltd. | | |
| LDB311G5020C-420 | Chip Multilayer Hybrid Baluns | Murata Manufacturing Co., Ltd. | | |
| LDB311G6005C-300 | Chip Multilayer Hybrid Baluns | Murata Manufacturing Co., Ltd. | | |
| LDB311G6010C-300 | Chip Multilayer Hybrid Baluns | Murata Manufacturing Co., Ltd. | | |
| LDB311G6020C-300 | Chip Multilayer Hybrid Baluns | Murata Manufacturing Co., Ltd. | | |
| LDB311G7005C-300 | Chip Multilayer Hybrid Baluns | Murata Manufacturing Co., Ltd. | | |
| LDB311G7010C-300 | Chip Multilayer Hybrid Baluns | Murata Manufacturing Co., Ltd. | | |
| LDB311G7020C-300 | Chip Multilayer Hybrid Baluns | Murata Manufacturing Co., Ltd. | | |
