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| Результаты поиска для LE82GM965 | |
| Компонент | Описание | Производитель | PDF | Buy |
| NX8564LE820-BC | NECs EA MODULATOR INTEGRATED InGaAsP MQW DFB LASER DIODE MODULE FOR 2.5 Gb/s ULTRALONG-REACH 360, 600, 240 km DWDM APPLICATIONS | California Eastern Labs |  |  |
| NX8565LE820-BC | NECs EA MODULATOR INTEGRATED InGaAsP MQW DFB LASER DIODE MODULE FOR 2.5 Gb/s ULTRALONG-REACH 360, 600, 240 km DWDM APPLICATIONS | California Eastern Labs | | |
| NX8566LE820-BC | NECs EA MODULATOR INTEGRATED InGaAsP MQW DFB LASER DIODE MODULE FOR 2.5 Gb/s ULTRALONG-REACH 360, 600, 240 km DWDM APPLICATIONS | California Eastern Labs | | |
| NX8564LE820-CC | NECs EA MODULATOR INTEGRATED InGaAsP MQW DFB LASER DIODE MODULE FOR 2.5 Gb/s ULTRALONG-REACH 360, 600, 240 km DWDM APPLICATIONS | California Eastern Labs | | |
| NX8565LE820-CC | NECs EA MODULATOR INTEGRATED InGaAsP MQW DFB LASER DIODE MODULE FOR 2.5 Gb/s ULTRALONG-REACH 360, 600, 240 km DWDM APPLICATIONS | California Eastern Labs | | |
| NX8566LE820-CC | NECs EA MODULATOR INTEGRATED InGaAsP MQW DFB LASER DIODE MODULE FOR 2.5 Gb/s ULTRALONG-REACH 360, 600, 240 km DWDM APPLICATIONS | California Eastern Labs | | |
| TLE8201R | Door Module Power IC | Infineon Technologies AG | | |
| TLE8203E | Mirror Power IC | Infineon Technologies AG | | |
| TLE8209-2SA | SPI Programmable H-Bridge | Infineon Technologies AG | | |
| TLE8242-2 | 8 Channel Fixed Frequency Constant Current Control With Current Profile Detection | Infineon Technologies AG | | |
| TLE8250G | High Speed CAN-Transceiver | Infineon Technologies AG | | |
| TLE8250GVIO | High Speed CAN-Transceiver | Infineon Technologies AG | | |
| TLE8261-2E | Universal System Basis Chip | Infineon Technologies AG | | |
| TLE8261E | Universal System Basis Chip HERMES Rev. 1.0 | Infineon Technologies AG | | |
| TLE8262-2E | Universal System Basis Chip | Infineon Technologies AG | | |
| TLE8262E | Universal System Basis Chip HERMES Rev. 1.0 | Infineon Technologies AG | | |
| TLE8263-2E | Universal System Basis Chip | Infineon Technologies AG | | |
| TLE8263E | Universal System Basis Chip HERMES Rev. 1.0 | Infineon Technologies AG | | |
| TLE8264-2E | Universal System Basis Chip | Infineon Technologies AG | | |
| TLE8264E | Universal System Basis Chip HERMES Rev. 1.0 | Infineon Technologies AG | | |
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