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Поиск Datasheets |
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| 507-145E15EB |
EMI/RFI Split Shell Banding Backshell |
Glenair, Inc. |
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507-145E15EB Datasheet
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Постоянная ссылка на эту страницу |
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507-145E15EB и другие |
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| Компонент | Описание | Производитель | PDF |
| A-70567-0349 |
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76lm (30l) Gold, (Au) Selective Plating |
Molex Electronics Ltd. |
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| AS29LV800B-70RTC |
3V 1M‡8/512K‡16 CMOS Flash EEPROM |
ANADIGICS, Inc |
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| 380AB103NF10 |
EMI/RFI Non-Environmental Backshell with Strain Relief |
Glenair, Inc. |
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| A-70567-0345 |
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
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| 0026603180 |
3.96mm (.156") Pitch KK Solid Header, Right Angle, without Peg, 18 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
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