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![](/forums/images/ca_evo_db/misc/spacer.gif) | 0015-80-0307 DATASHEET | ![](/forums/images/ca_evo_db/misc/spacer.gif) |
Компонент | Описание | Производитель | PDF | Buy |
0015-80-0307 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
![](/forums/images/ca_evo_db/misc/spacer.gif) | *0015-80-*: Расширенные результаты | ![](/forums/images/ca_evo_db/misc/spacer.gif) |
Компонент | Описание | Производитель | PDF | Buy |
0015-80-0307 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
0015-80-0407 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
0015-80-0489 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
0015-80-1123 | 2.54mm Pitch C-Grid^ Header | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
0015-80-1143 | 2.54mm Pitch C-Grid^ Header | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
0015-80-1163 | 2.54mm Pitch C-Grid^ Header | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
0015-80-1181 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
0015-80-1241 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
0015-80-1261 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
0015-80-1321 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
0015-80-1324 | 2.54mm Pitch C-Grid^ Header | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
0015-80-1341 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
0015-80-1361 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
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