| Компонент | Описание | Производитель | PDF | Buy |
| 05803503 | tyco electronics contents | Tyco Electronics |  |  |
| 06203503 | tyco electronics contents | Tyco Electronics | | |
| R7003503 | General Purpose Rectifier (300-550 Amperes Average 4400 Volts) | Powerex Power Semiconductors | | |
| 0930503503 | 2.50mm (.098") Pitch Appli-Mate RAST 2.5 Female Connector, Glow Wire Compliant 10 Circuits | Molex Electronics Ltd. | | |
| 0510350300 | 2.50mm (.098") Pitch Board-In Housing, 3 Circuits | Molex Electronics Ltd. | | |
| 0780350301 | 0.60mm (.024) Pitch miniDIMM DDR3 Socket, Surface Mount, 22.5` Reverse Angle, 0.76lm (30l) Gold (Au) Plating, Off-White Latches, 244 Circuits,1.5V Voltage Key | Molex Electronics Ltd. | | |
| 2CW035030JL | 2CW035XXXJL SERIES ZENER DIODE CHIPS FOR PLASTIC PACKAGE | Silan Microelectronics Joint-stock | | |
| 2CW035030JLR | 2CW035XXXJLR SERIES ZNER DIODE CHIPS FOR PLASTIC PACKAGE WITH ASYMMETRY LIMITS | Silan Microelectronics Joint-stock | | |
| 2SB035030MLJY | 2SB035030MLJY SCHOTTKY BARRIER DIODE CHIPS | Silan Microelectronics Joint-stock | | |
| 2CW035030YQ | 2CW035XXXYQ SERIES ZENER DIODE CHIPS FOR GLASS SEAL | Silan Microelectronics Joint-stock | | |
| 2CW035030YQ5 | 2CW035XXXYQ SERIES ZENER DIODE CHIPS FOR GLASS SEAL | Silan Microelectronics Joint-stock | | |
| NT0350311 | Circuit Protection Thermistors | AMETHERM Circuit Protection Thermistors | | |
| 0350329901 | 7.92mm (.312") Tab Slip-on Wire-to-Wire, Terminal, Female, 10-12 AWG, Tin Plated | Molex Electronics Ltd. | | |
| 2CW035033JL | 2CW035XXXJL SERIES ZENER DIODE CHIPS FOR PLASTIC PACKAGE | Silan Microelectronics Joint-stock | | |
| 2CW035033JLR | 2CW035XXXJLR SERIES ZNER DIODE CHIPS FOR PLASTIC PACKAGE WITH ASYMMETRY LIMITS | Silan Microelectronics Joint-stock | | |
| 2CW035033YQ | 2CW035XXXYQ SERIES ZENER DIODE CHIPS FOR GLASS SEAL | Silan Microelectronics Joint-stock | | |
| 2CW035033YQ5 | 2CW035XXXYQ SERIES ZENER DIODE CHIPS FOR GLASS SEAL | Silan Microelectronics Joint-stock | | |
| 0022035035 | 2.50mm (.098) Pitch SPOX Wire-to-Board Header, Vertical, Shrouded, 3 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
| ATS035035002-MF-11A | 35.00 x 35.00 x 2.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Slant Fin | Advanced Thermal Solutions, Inc. | | |
| ATS035035003-MF-11B | 35.00 x 35.00 x 3.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Slant Fin | Advanced Thermal Solutions, Inc. | | |
