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| 0877970010 DATASHEET | |
| Компонент | Описание | Производитель | PDF | Buy |
0877970010 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row Dual Body, Vertical, 34 Circuits, Tin (Sn) Overall Plating, 15.10mm (.594) Stacking Height, Tray Packaging | Molex Electronics Ltd. |  |  |
| *08779*: Расширенные результаты | |
| Компонент | Описание | Производитель | PDF | Buy |
| 0877910114 | 2.00mm (.079) Pitch Board-to-Board Panel Detachable, PCB Receptacle, Surface Mount, 14 Circuits, Gold (Au) Selective Plating, Tray Packaging, Lead-free | Molex Electronics Ltd. | | |
| 0877910116 | 2.00mm (.079) Pitch Board-to-Board Panel Detachable, PCB Receptacle, Surface Mount, 16 Circuits, Gold (Au) Selective Plating, Tray Packaging, Lead-free | Molex Electronics Ltd. | | |
| 0877910120 | 2.00mm (.079) Pitch Board-to-Board Panel Detachable, PCB Receptacle, Surface Mount, 20 Circuits, Gold (Au) Selective Plating, Tray Packaging, Lead-free | Molex Electronics Ltd. | | |
| 0877921114 | 2.00mm (.079) Pitch Board-to-Board Panel Detachable, PCB Header, Surface Mount, 14 Circuits, Gold (Au) Selective Plating, with Pick-and-Place Cap | Molex Electronics Ltd. | | |
| 0877921116 | 2.00mm (.079) Pitch Board-to-Board Panel Detachable, PCB Header, Surface Mount, 16 Circuits, Gold (Au) Selective Plating, with Pick-and-Place Cap, Tube Packaging | Molex Electronics Ltd. | | |
| 0877921120 | 2.00mm (.079) Pitch Board-to-Board Panel Detachable, PCB Header, Surface Mount, 20 Circuits, Gold (Au) Selective Plating, with Pick-and-Place Cap, Tube Packaging | Molex Electronics Ltd. | | |
| 0877922116 | 2.00mm (.079) Pitch Board-to-Board Panel Detachable PCB Header, Surface Mount, 16 Circuits, Gold (Au) Selective Plating, with Pick-and-Place Cap | Molex Electronics Ltd. | | |
| 0877922120 | 2.00mm (.079) Pitch Board-to-Board Panel Detachable PCB Header, Surface Mount, 20 Circuits, Gold (Au) Selective Plating, with Pick-and-Place Cap | Molex Electronics Ltd. | | |
| 0877940001 | 2.50mm (.098) / 3.00mm (.118) Pitch Wire-to Board Receptacle Housing with Fuse, with Bottom Flange, 16 Circuits | Molex Electronics Ltd. | | |
| 0877940002 | 2.50mm (.098) / 3.00mm (.118) Pitch Wire-to-Board Receptacle Housing with Fuse, with Side Flange, 16 Circuits | Molex Electronics Ltd. | | |
| 0877970010 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row Dual Body, Vertical, 34 Circuits, Tin (Sn) Overall Plating, 15.10mm (.594) Stacking Height, Tray Packaging | Molex Electronics Ltd. | | |
| 0877970040 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row Dual Body, Vertical, 40 Circuits, 2.54lm (100l) Tin (Sn) Plating, 14.22mm (.560) Stacking Height | Molex Electronics Ltd. | | |
| 0877970602 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row Dual Body, Vertical, 6 Circuits, 0.76lm (30l) Gold (Au) Plating, 25.60mm (1.043) Stacking Height | Molex Electronics Ltd. | | |
| 0877971200 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row Dual Body, Vertical, 12 Circuits, 0.76lm (30l) Gold (Au) Plating, 8.00mm (.315) Stacking Height | Molex Electronics Ltd. | | |
| 0877971800 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row Dual Body, Vertical, 18 Circuits, Gold (Au) Flash Plating, 9.35mm (.368) Stacking Height, Tray Packaging | Molex Electronics Ltd. | | |
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