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| 21-0102 DATASHEET | |
| Компонент | Описание | Производитель | PDF | Buy |
21-0102 | PACKAGE OUTLINE, 12,16L QFN, 3x3x0.90 MM | Dallas Semiconductor |  |  |
| *21-010*: Расширенные результаты | |
| Компонент | Описание | Производитель | PDF | Buy |
| 031-8521-010 | Cannon APD Series ISO 15170 Connectors | ITT Industries | | |
| SD-19221-010 | Compression Style Ring Tongue Terminal | Molex Electronics Ltd. | | |
| SD-19221-010 | Compression Style Ring Tongue Terminal | Molex Electronics Ltd. | | |
| SD-19221-010 | Compression Style Ring Tongue Terminal for 4 AWG Wire | Molex Electronics Ltd. | | |
| SD-19221-010 | Compression Style Ring Tongue Terminal | Molex Electronics Ltd. | | |
| SD-19221-010 | Compression Style Ring Tongue Terminal | Molex Electronics Ltd. | | |
| SD-19221-010 | Compression Style Ring Tongue Terminal | Molex Electronics Ltd. | | |
| SD-19221-010 | Compression Style Ring Tongue Terminal for 1 AWG Wire | Molex Electronics Ltd. | | |
| SD-19221-010 | Compression Style Ring Tongue Terminal for 2 AWG Wire | Molex Electronics Ltd. | | |
| SD-19221-010 | Compression Style Ring Tongue Terminal | Molex Electronics Ltd. | | |
| SD-19221-010 | Compression Style Ring Tongue Terminal | Molex Electronics Ltd. | | |
| SD-19221-010 | Compression Style Ring Tongue Terminal for 1 AWG Cable | Molex Electronics Ltd. | | |
| 21-0102 | PACKAGE OUTLINE, 12,16L QFN, 3x3x0.90 MM | Dallas Semiconductor | | |
| 21-0104 | PACKAGE OUTLINE, 12BUMPS, 3*4ARRAY, UCSP(B)PKG. | Maxim Integrated Products | | |
| 21-0108 | PACKAGE OUTLINE, TSSOP 4.4MM BODY, EXPOSED PAD | Maxim Integrated Products | | |
| 21-0109B | PACKAGE OUTLINE, 10L uMAX, EXPOSED PAD | Maxim Integrated Products | | |
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