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| 34-261X-W-6-6-6-6 DATASHEET | |
Компонент | Описание | Производитель | PDF | Buy |
34-261X-W-6-6-6-6 | OUTLINE, WR34 HYBRID COUPLER, STYLE W | Advanced Technical Materials Inc. | | |
| *34-26*: Расширенные результаты | |
Компонент | Описание | Производитель | PDF | Buy |
87834-2611 | 2.54mm (.100) Pitch C-Grid^ Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 26 Circuits, Gold (Au) Flash, Beige, PCB Locators, without End Window | Molex Electronics Ltd. | | |
87834-2619 | 2.54mm (.100) Pitch C-Grid^ Header, Dual Row, Low Profile, Vertical, Shrouded, 26 Circuits, 0.13lm (5l) Gold (Au) Plating, Black, without PCB Locator | Molex Electronics Ltd. | | |
34-261X-W-6-6-6-6 | OUTLINE, WR34 HYBRID COUPLER, STYLE W | Advanced Technical Materials Inc. | | |
87834-2621 | 2.54mm (.100) Pitch C-Grid^ Header, Dual Row, Low Profile, Vertical, Shrouded, PCB Locators, with End Windows, 0.13lm (5l) Gold (Au) Flash Plating | Molex Electronics Ltd. | | |
87834-2641 | 2.54mm (.100) Pitch C-Grid^ Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13lm (5l) Gold (Au) Flash Plating | Molex Electronics Ltd. | | |
87834-2645 | 2.54mm (.100) Pitch C-Grid^ Header, Dual Row, Low Profile, Vertical, Through Hole, Shrouded, Lead-free, 26 Circuits, 0.13lm (5l) Gold (Au) Selective Plating, Black | Molex Electronics Ltd. | | |
RC32434-266BC | IDT TInterprise Integrated Communications Processor | Integrated Device Technology | | |
RC32434-266BCI | IDT TInterprise Integrated Communications Processor | Integrated Device Technology | | |
87834-2695 | 2.54mm (.100) Pitch C-Grid^ Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.05lm (2l) Gold (Au) Plating | Molex Electronics Ltd. | | |
2534-26K | Molded Unshielded RF Coils | List of Unclassifed Manufacturers | | |
2534-26K | Molded Unshielded RF Coils | API Delevan | | |
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