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| 44067-1201 DATASHEET | |
Компонент | Описание | Производитель | PDF | Buy |
44067-1201 | 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 12 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
| *44067-1*: Расширенные результаты | |
Компонент | Описание | Производитель | PDF | Buy |
44067-1001 | 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") | Molex Electronics Ltd. | | |
44067-1002 | 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") | Molex Electronics Ltd. | | |
44067-1003 | 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") | Molex Electronics Ltd. | | |
44067-1201 | 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 12 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
44067-1202 | 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB | Molex Electronics Ltd. | | |
44067-1203 | 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 12 Circuits, 0.76lm (30l") Gold (Au) Selective Plating | Molex Electronics Ltd. | | |
44067-1401 | 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB | Molex Electronics Ltd. | | |
44067-1402 | 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header | Molex Electronics Ltd. | | |
44067-1403 | 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 14 Circuits, 0.76lm (30l") Gold (Au) Selective Plating | Molex Electronics Ltd. | | |
44067-1601 | 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") | Molex Electronics Ltd. | | |
44067-1602 | 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB | Molex Electronics Ltd. | | |
44067-1603 | 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 16 Circuits, 0.76lm (30l") Gold (Au) Selective Plating | Molex Electronics Ltd. | | |
44067-1801 | 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 18 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
44067-1802 | 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB | Molex Electronics Ltd. | | |
44067-1803 | 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header | Molex Electronics Ltd. | | |
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