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![](/forums/images/ca_evo_db/misc/spacer.gif) | 568-0141-1113 DATASHEET | ![](/forums/images/ca_evo_db/misc/spacer.gif) |
Компонент | Описание | Производитель | PDF | Buy |
568-0141-1113 | 4X3 CB1 ARRAY BLOCK | Dialight Corporation | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
![](/forums/images/ca_evo_db/misc/spacer.gif) | *568-014*: Расширенные результаты | ![](/forums/images/ca_evo_db/misc/spacer.gif) |
Компонент | Описание | Производитель | PDF | Buy |
A-70568-0140 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
A-70568-0141 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
568-0141-1113 | 4X3 CB1 ARRAY BLOCK | Dialight Corporation | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
A-70568-0142 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
568-0142-2223 | 4X3 CB1 ARRAY BLOCK | Dialight Corporation | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
A-70568-0143 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
568-0143-3333 | 4X3 CB1 ARRAY BLOCK | Dialight Corporation | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
A-70568-0144 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
A-70568-0145 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
A-70568-0146 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
A-70568-0147 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
A-70568-0148 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
A-70568-0149 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
568-014X-XXX3 | 4X3 CB1 ARRAY BLOCK | Dialight Corporation | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
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