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| 60811B107 DATASHEET | |
| Компонент | Описание | Производитель | PDF | Buy |
60811B107 | Conductor Anvil | Molex Electronics Ltd. |  |  |
| *60811B*: Расширенные результаты | |
| Компонент | Описание | Производитель | PDF | Buy |
| K4F660811B | 8M x 8bit CMOS Dynamic RAM with Fast Page Mode | Samsung semiconductor | | |
| K4F660811B | 8M x 8bit CMOS Dynamic RAM with Fast Page Mode | Samsung semiconductor | | |
| K4F660811B-JC-45 | 8M x 8bit CMOS dynamic RAM with fast page mode, 5V, 45ns | Samsung semiconductor | | |
| K4F660811B-JC-50 | 8M x 8bit CMOS dynamic RAM with fast page mode, 5V, 50ns | Samsung semiconductor | | |
| K4F660811B-JC-60 | 8M x 8bit CMOS dynamic RAM with fast page mode, 5V, 60ns | Samsung semiconductor | | |
| K4F660811B-TC-45 | 8M x 8bit CMOS dynamic RAM with fast page mode, 5V, 45ns | Samsung semiconductor | | |
| K4F660811B-TC-50 | 8M x 8bit CMOS dynamic RAM with fast page mode, 5V, 50ns | Samsung semiconductor | | |
| K4F660811B-TC-60 | 8M x 8bit CMOS dynamic RAM with fast page mode, 5V, 60ns | Samsung semiconductor | | |
| 60811B106 | Conductor Punch | Molex Electronics Ltd. | | |
| 60811B107 | Conductor Anvil | Molex Electronics Ltd. | | |
| 60811B108 | Insulation Punch | Molex Electronics Ltd. | | |
| 60811B109 | Insulation Anvil | Molex Electronics Ltd. | | |
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