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Мой поиск: A-70563-0120 TD1E37HPM-C CTE8001GF6 AGN210S09Z DDS-CJS-R1 AFL120XXS AP130-19R APC77157


A-70563-0120 DATASHEET

КомпонентОписаниеПроизводительPDFBuy
A-70563-0120
2.54mm (.100") Pitch SL Header, Single Row, Vertical, .180" Pocket, Shrouded, 16 Circuits, 0.76lm (30l") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
Molex Electronics Ltd.

*A-7056*: Расширенные результаты

КомпонентОписаниеПроизводительPDFBuy
SDA-70563-0010
2.54mm (.100") Pitch SL Header
Molex Electronics Ltd.
A-70563-0011
2.54mm (.100") Pitch SL Header, Single Row, Vertical, .180" Pocket, Shrouded, 12 Circuits, 0.38lm (15l") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
Molex Electronics Ltd.
A-70563-0015
2.54mm (.100") Pitch SL Header, Single Row, Vertical, .180" Pocket, Shrouded, 16 Circuits, 0.38lm (15l") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
Molex Electronics Ltd.
A-70563-0017
2.54mm (.100") Pitch SL Header, Single Row, Vertical, .180" Pocket, Shrouded, 18 Circuits, 0.38um
Molex Electronics Ltd.
A-70563-0050
2.54mm (.100) Pitch SL Header, Single Row, Vertical, .180" Pocket, Shrouded, 16 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.
A-70563-0115
2.54mm (.100") Pitch SL Header, Single Row, Vertical, .180" Pocket, Shrouded, 11 Circuits, 0.76lm (30l") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
Molex Electronics Ltd.
A-70563-0120
2.54mm (.100") Pitch SL Header, Single Row, Vertical, .180" Pocket, Shrouded, 16 Circuits, 0.76lm (30l") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
Molex Electronics Ltd.
A-70567-0001
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.
A-70567-0002
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.
A-70567-0002
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.
A-70567-0003
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.
A-70567-0003
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.
A-70567-0004
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.
A-70567-0004
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.
A-70567-0005
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.
A-70567-0005
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.
A-70567-0006
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.
A-70567-0006
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.
A-70567-0007
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.
A-70567-0007
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.
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