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| A-70563-0120 DATASHEET | |
Компонент | Описание | Производитель | PDF | Buy |
A-70563-0120 | 2.54mm (.100") Pitch SL Header, Single Row, Vertical, .180" Pocket, Shrouded, 16 Circuits, 0.76lm (30l") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating | Molex Electronics Ltd. | | |
| *A-7056*: Расширенные результаты | |
Компонент | Описание | Производитель | PDF | Buy |
SDA-70563-0010 | 2.54mm (.100") Pitch SL Header | Molex Electronics Ltd. | | |
A-70563-0011 | 2.54mm (.100") Pitch SL Header, Single Row, Vertical, .180" Pocket, Shrouded, 12 Circuits, 0.38lm (15l") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating | Molex Electronics Ltd. | | |
A-70563-0015 | 2.54mm (.100") Pitch SL Header, Single Row, Vertical, .180" Pocket, Shrouded, 16 Circuits, 0.38lm (15l") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating | Molex Electronics Ltd. | | |
A-70563-0017 | 2.54mm (.100") Pitch SL Header, Single Row, Vertical, .180" Pocket, Shrouded, 18 Circuits, 0.38um | Molex Electronics Ltd. | | |
A-70563-0050 | 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .180" Pocket, Shrouded, 16 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
A-70563-0115 | 2.54mm (.100") Pitch SL Header, Single Row, Vertical, .180" Pocket, Shrouded, 11 Circuits, 0.76lm (30l") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating | Molex Electronics Ltd. | | |
A-70563-0120 | 2.54mm (.100") Pitch SL Header, Single Row, Vertical, .180" Pocket, Shrouded, 16 Circuits, 0.76lm (30l") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating | Molex Electronics Ltd. | | |
A-70567-0001 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
A-70567-0002 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
A-70567-0002 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
A-70567-0003 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
A-70567-0003 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
A-70567-0004 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
A-70567-0004 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
A-70567-0005 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
A-70567-0005 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
A-70567-0006 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
A-70567-0006 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
A-70567-0007 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
A-70567-0007 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
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