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![](/forums/images/ca_evo_db/misc/spacer.gif) | A-70567-0163 DATASHEET | ![](/forums/images/ca_evo_db/misc/spacer.gif) |
Компонент | Описание | Производитель | PDF | Buy |
A-70567-0163 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
![](/forums/images/ca_evo_db/misc/spacer.gif) | *A-70567-016*: Расширенные результаты | ![](/forums/images/ca_evo_db/misc/spacer.gif) |
Компонент | Описание | Производитель | PDF | Buy |
A-70567-0160 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 52 Circuits | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
A-70567-0160 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
A-70567-0161 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
A-70567-0161 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 54 Circuits | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
A-70567-0162 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 56 Circuits, 0.76lm (30l) Gold (Au) Selective Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
A-70567-0162 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
A-70567-0163 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
A-70567-0163 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 58 Circuits, 0.76lm (30l) Gold (Au) Selective Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
A-70567-0164 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 60 Circuits, 0.76lm (30l) Gold (Au) Selective Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
A-70567-0164 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
A-70567-0165 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
A-70567-0165 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 62 Circuits, 0.76lm (30l) Gold (Au) Selective Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
A-70567-0166 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 64 Circuits, 0.76lm (30l) Gold (Au) Selective Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
A-70567-0166 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
A-70567-0167 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
A-70567-0168 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, 0.76lm (30l) Gold (Au) Selective Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
A-70567-0168 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
A-70567-0169 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
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