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![](/forums/images/ca_evo_db/misc/spacer.gif) | A-70567-0277 DATASHEET | ![](/forums/images/ca_evo_db/misc/spacer.gif) |
Компонент | Описание | Производитель | PDF | Buy |
A-70567-0277 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.38lm (15l) Gold, (Au) Selective Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
![](/forums/images/ca_evo_db/misc/spacer.gif) | *A-70567-027*: Расширенные результаты | ![](/forums/images/ca_evo_db/misc/spacer.gif) |
Компонент | Описание | Производитель | PDF | Buy |
A-70567-0270 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
A-70567-0271 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
A-70567-0272 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
A-70567-0273 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.38lm (15l) Gold, (Au) Selective Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
A-70567-0273 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
A-70567-0274 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38lm (15l) Gold, (Au) Selective Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
A-70567-0274 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
A-70567-0275 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
A-70567-0275 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.38lm (15l) Gold, (Au) Selective Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
A-70567-0276 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38lm (15l) Gold, (Au) Selective Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
A-70567-0276 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
A-70567-0277 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.38lm (15l) Gold, (Au) Selective Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
A-70567-0277 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
A-70567-0278 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38lm (15l) Gold, (Au) Selective Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
A-70567-0278 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
A-70567-0279 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, 0.38lm (15l) Gold, (Au) Selective Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
A-70567-0279 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | ![](/images/pdf_icon.png) | ![](/images/alisearch.png) |
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