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| A-70567-0342 DATASHEET | |
Компонент | Описание | Производитель | PDF | Buy |
A-70567-0342 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
| *A-70567-034*: Расширенные результаты | |
Компонент | Описание | Производитель | PDF | Buy |
A-70567-0340 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
A-70567-0341 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76lm (30l) Gold, (Au) Selective Plating | Molex Electronics Ltd. | | |
A-70567-0341 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
A-70567-0342 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
A-70567-0343 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
A-70567-0343 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76lm (30l) Gold, (Au) Selective Plating | Molex Electronics Ltd. | | |
A-70567-0344 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76lm (30l) Gold, (Au) Selective Plating | Molex Electronics Ltd. | | |
A-70567-0344 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
A-70567-0345 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
A-70567-0346 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76lm (30l) Gold, (Au) Selective Plating | Molex Electronics Ltd. | | |
A-70567-0346 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
A-70567-0347 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
A-70567-0348 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.76lm (30l) Gold, (Au) Selective Plating | Molex Electronics Ltd. | | |
A-70567-0348 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
A-70567-0349 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76lm (30l) Gold, (Au) Selective Plating | Molex Electronics Ltd. | | |
A-70567-0349 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
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