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| SH0R3D42 DATASHEET | |
| Компонент | Описание | Производитель | PDF | Buy |
SH0R3D42 | HIGH SPEED SWITCHING AND CONTROL APPLICATIONS | Toshiba Semiconductor |  |  |
| *SH0*: Расширенные результаты | |
| Компонент | Описание | Производитель | PDF | Buy |
| QST108SH0 | Capacitive touch sensor device 8 keys with individual key state outputs or I2C interface | STMicroelectronics | | |
| QST508SH0 | Capacitive touch sensor device 8 keys with individual key state outputs or I2C interface | STMicroelectronics | | |
| QST608SH0 | Capacitive touch sensor device 8 keys with individual key state outputs or I2C interface | STMicroelectronics | | |
| QST1108SH0 | Capacitive touch sensor device 8 keys with individual key state outputs or I2C interface | STMicroelectronics | | |
| QST1508SH0 | Capacitive touch sensor device 8 keys with individual key state outputs or I2C interface | STMicroelectronics | | |
| QST1608SH0 | Capacitive touch sensor device 8 keys with individual key state outputs or I2C interface | STMicroelectronics | | |
| S75WS256NDFBAWSH0 | Stacked Multi-Chip Product (MCP) | SPANSION | | |
| S75WS256NDFBAWSH0 | Stacked Multi-Chip Product (MCP) | SPANSION | | |
| S75WS256NDGBAWSH0 | Stacked Multi-Chip Product (MCP) | SPANSION | | |
| S75WS256NDFBFWSH0 | Stacked Multi-Chip Product (MCP) | SPANSION | | |
| S75WS256NDFBFWSH0 | Stacked Multi-Chip Product (MCP) | SPANSION | | |
| S75WS256NDGBAWSH0 | Stacked Multi-Chip Product (MCP) | SPANSION | | |
| S75WS256NDGBFWSH0 | Stacked Multi-Chip Product (MCP) | SPANSION | | |
| S75WS256NEFBAWSH0 | Stacked Multi-Chip Product (MCP) | SPANSION | | |
| S75WS256NEFBAWSH0 | Stacked Multi-Chip Product (MCP) | SPANSION | | |
| S75WS256NEFBFWSH0 | Stacked Multi-Chip Product (MCP) | SPANSION | | |
| S75WS256NEGBAWSH0 | Stacked Multi-Chip Product (MCP) | SPANSION | | |
| S75WS256NEGBFWSH0 | Stacked Multi-Chip Product (MCP) | SPANSION | | |
| S75WS256NEGBFWSH0 | Stacked Multi-Chip Product (MCP) | SPANSION | | |
| S75WS256NDGBFWSH0 | Stacked Multi-Chip Product (MCP) | SPANSION | | |
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