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Поиск Datasheets |
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| 73642-2209 |
2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, Press-FitOpen End, 72 Circuits, Lead Free |
Molex Electronics Ltd. |
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73642-2209 Datasheet
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Постоянная ссылка на эту страницу |
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73642-2209 и другие |
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| Компонент | Описание | Производитель | PDF |
| 370AB006NF14 |
Splash-Proof Cable Sealing Backshell |
Glenair, Inc. |
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| 0015910228 |
2.54mm (.100) Pitch C-Grid^ Header, Surface Mount, Dual Row, Vertical, 4 Circuits, Tin (Sn) Plating, without PCB Locator Pegs |
Molex Electronics Ltd. |
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| A-42226-0052 |
2.54mm (.100) Pitch KK^ Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 17 Circuits, 0.38lm (15l) Gold (Au) Selective Plating |
Molex Electronics Ltd. |
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| 73643-1000 |
2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, Press-Fit, Closed End, 144 Circuits |
Molex Electronics Ltd. |
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| A-42226-0073 |
2.54mm (.100) Pitch KK^ Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 3 Circuits, 0.76lm (30l) Gold (Au) Selective Plating |
Molex Electronics Ltd. |
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