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Поиск Datasheets |
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| 73644-2200 |
2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position A, 72 Circuits |
Molex Electronics Ltd. |
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73644-2200 Datasheet
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Постоянная ссылка на эту страницу |
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73644-2200 и другие |
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| Компонент | Описание | Производитель | PDF |
| 1N1344 |
Rectifiers |
New Jersey Semi-Conductor Products, Inc. |
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| 501571-3051 |
1.0 WIRE TO BOARD CONN. 2-ROW R/A WAFER ASSY -LEAD FREE- |
Molex Electronics Ltd. |
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| 73644-2205 |
2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location A, Polarizing Key Position C, 72 Circuits |
Molex Electronics Ltd. |
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| 0015910467 |
2.54mm (.100) Pitch C-Grid^ Header, Surface Mount, Dual Row, Vertical, 4 Circuits, Tin (Sn) Plating, without PCB Locator Pegs |
Molex Electronics Ltd. |
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| 25AA320AT-E/SN |
32K SPI Bus Serial EEPROM |
Microchip Technology |
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