 |
Поиск Datasheets |
|
| 73644-3202 |
2.00mm (.079) Pitch HDM^ Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position B, 144 Circuits |
Molex Electronics Ltd. |
 |
|
73644-3202 Datasheet
|
|
|
|
Постоянная ссылка на эту страницу |
|
|
73644-3202 и другие |
|
| Компонент | Описание | Производитель | PDF |
| 370AR024M10 |
Submersible Split Shell Cable Sealing Backshell |
Glenair, Inc. |
|
| 1N1347B |
SILICON POWER RECTIFIER |
Microsemi Corporation |
|
| A-42226-0192 |
2.54mm (.100) Pitch KK^ Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 17 Circuits, 0.76lm (30l) Gold (Au) Selective Plating, with Kinked PC Tails |
Molex Electronics Ltd. |
|
| 73644-3116 |
2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position N/A, 144 Circuits |
Molex Electronics Ltd. |
|
| 5015681307 |
1.00mm (.039") Pitch Pico-Clasp Wire-to-Board Header, Surface Mount, Single Row, Right Angle |
Molex Electronics Ltd. |
|
|  |
|
Datasheet's на KAZUS.RU |
|
|
• 10.000.000 компонентов
• 300.000 поисковых запросов
• 500.000 закачек PDF в месяц
• 700.000 пользователей
|
|
Реклама на сайте |
|
|
|
|
|
|
