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Поиск Datasheets |
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| 370AW016XB08 |
Composite Cable-Sealing Environmental Backshell |
Glenair, Inc. |
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370AW016XB08 Datasheet
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Постоянная ссылка на эту страницу |
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370AW016XB08 и другие |
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| Компонент | Описание | Производитель | PDF |
| 25AA640AT-I/MS |
64K SPI Bus Serial EEPROM |
Microchip Technology |
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| 5016452220 |
2.00mm (.079") Pitch iGrid Wire-to-Board Header, Dual Row, Vertical, with PCB Locator, 22 Circuits, Lead-free |
Molex Electronics Ltd. |
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| 370AS017XM13 |
Composite Cable-Sealing Environmental Backshell |
Glenair, Inc. |
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| 370AS017XO12 |
Composite Cable-Sealing Environmental Backshell |
Glenair, Inc. |
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| 0015911242 |
2.54mm (.100) Pitch C-Grid^ Header, Surface Mount, Dual Row, Vertical, 24 Circuits, 0.38lm (15l) Gold (Au) Selective Plating, with 3.30mm (.130) PCB Locator Pegs |
Molex Electronics Ltd. |
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