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Поиск Datasheets |
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| 370FP024M18 |
Submersible Split Shell Cable Sealing Backshell |
Glenair, Inc. |
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370FP024M18 Datasheet
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Постоянная ссылка на эту страницу |
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370FP024M18 и другие |
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| Компонент | Описание | Производитель | PDF |
| 0015911764-ND |
2.54mm (.100) Pitch C-Grid^ Header, Surface Mount, Dual Row, Vertical, 4 Circuits, Tin (Sn) Plating, without PCB Locator Pegs |
Molex Electronics Ltd. |
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| AFK226M06B12T |
SMT Aluminum Electrolytic Capacitors - Lowest E.S.R., 105 ЉC |
Cornell Dubilier Electronics |
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| 26-7602-180-TE |
Up to 180 mW Fiber Bragg Grating Stabilized 980 nm Pump Modules with Tight Tracking |
JDS Uniphase Corporation |
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| 73782-7100 |
2.00mm (.079") Pitch HDM^ Board-to-Board Stacking Header, High Rise Vertical,SMC, Closed End Option, 144 Circuits |
Molex Electronics Ltd. |
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| 73782-6100 |
2.00mm (.079") Pitch HDM^ Board-to-Board Stacking Header, High Rise Vertical,SMC, Closed End Option, 72 Circuits |
Molex Electronics Ltd. |
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