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Поиск Datasheets |
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A-70567-0030 |
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 64 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
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A-70567-0030 Datasheet
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A-70567-0030 и другие |
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Компонент | Описание | Производитель | PDF |
380AA013M18 |
EMI/RFI Non-Environmental Backshell with Strain Relief |
Glenair, Inc. |
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0022552462 |
2.54mm (.100") Pitch SL Crimp Housing, Dual Row, Version B, Polarized, 46 Circuits |
Molex Electronics Ltd. |
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A-70567-0014 |
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
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A-70567-0027 |
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 58 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
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100325D |
Low Power Hex ECL-to-TTL Translator |
National Semiconductor |
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