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A-70567-0209 |
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
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A-70567-0209 Datasheet
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A-70567-0209 и другие |
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Компонент | Описание | Производитель | PDF |
380AB002NF16 |
EMI/RFI Non-Environmental Backshell with Strain Relief |
Glenair, Inc. |
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0026232131 |
3.96mm (.156") Pitch KK^ Wire-to-Board Header, Vertical Round Pin, 13 Circuits, Gold (Au) Plating, with Mating Pin Length of 11.43mm (.450") |
Molex Electronics Ltd. |
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1N3342A |
50W ZENER(DO5) |
Naina Semiconductor ltd. |
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0026232071 |
3.96mm (.156") Pitch KK^ Wire-to-Board Header, Vertical Round Pin, 7 Circuits, Gold (Au) Plating, with Mating Pin Length of 11.43mm (.450") |
Molex Electronics Ltd. |
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507-145-J51EB |
Micro-D Backshells EMI Split Backshell, Round Cable Entry 507-145 |
Glenair, Inc. |
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