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Поиск Datasheets |
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A-70567-0202 |
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
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A-70567-0202 Datasheet
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Постоянная ссылка на эту страницу |
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A-70567-0202 и другие |
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Компонент | Описание | Производитель | PDF |
A-70567-0153 |
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, 0.76lm (30l") Gold (Au) Selective Plating |
Molex Electronics Ltd. |
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380AB005NF08 |
EMI/RFI Non-Environmental Backshell |
Glenair, Inc. |
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507-145-M15HB |
Micro-D Backshells EMI Split Backshell, Round Cable Entry 507-145 |
Glenair, Inc. |
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A-70567-0162 |
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 56 Circuits, 0.76lm (30l) Gold (Au) Selective Plating |
Molex Electronics Ltd. |
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0026481035 |
3.96mm (.156") Pitch KK Header, Breakaway, Vertical, Square Pin, with Friction Lock, 3 Circuits |
Molex Electronics Ltd. |
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