CELLULAR DIE PACKAGE

Microsemi Corporation

2.36mm (.093") Diameter, Standard .093" Pin and Socket Crimp Terminal, Series 1190, Male, with Tin (Sn) Plated Brass Contact, 14-18 AWG, Large Insulation Crimp, Reel

Molex Electronics Ltd.

IGBT MODULES HIGH POWER SWITCHING USE

Mitsubishi Electric Semiconductor

10 TAP 14 PIN DIP PASSIVE DELAY MODULES

Bel Fuse Inc.

StarLEDs T2 (7mm) ESB with half wave rectifier

Chicago Miniature Lamp,inc

LED AlInGaN Super Blue Low current requirement.

BRIGHT LED ELECTRONICS CORP