|
Поиск Datasheets |
|
getting query A-70567-0287 searching datasheet pdf is found, procesing please wait...
| A-70567-0287 DATASHEET | |
Компонент | Описание | Производитель | PDF | Buy |
A-70567-0287 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
| *A-70567-028*: Расширенные результаты | |
Компонент | Описание | Производитель | PDF | Buy |
A-70567-0280 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
A-70567-0280 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38lm (15l) Gold, (Au) Selective Plating | Molex Electronics Ltd. | | |
A-70567-0281 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.38lm (15l) Gold, (Au) Selective Plating | Molex Electronics Ltd. | | |
A-70567-0281 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
A-70567-0282 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, 0.38lm (15l) Gold, (Au) Selective Plating | Molex Electronics Ltd. | | |
A-70567-0282 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
A-70567-0283 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.38lm (15l) Gold, (Au) Selective Plating | Molex Electronics Ltd. | | |
A-70567-0283 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
A-70567-0284 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.38lm (15l) Gold, (Au) Selective Plating | Molex Electronics Ltd. | | |
A-70567-0284 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
A-70567-0285 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, 0.38lm (15l) Gold, (Au) Selective Plating | Molex Electronics Ltd. | | |
A-70567-0285 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
A-70567-0286 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, 0.38lm (15l) Gold, (Au) Selective Plating | Molex Electronics Ltd. | | |
A-70567-0286 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
A-70567-0287 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
A-70567-0288 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits, 0.38lm (15l) Gold, (Au) Selective Plating | Molex Electronics Ltd. | | |
A-70567-0288 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
A-70567-0289 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | Molex Electronics Ltd. | | |
Поиск занял 0.0188 сек.
|