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| 360AW014XM08 |
Composite Non-Environmental Backshell |
Glenair, Inc. |
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360AW014XM08 Datasheet
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| Компонент | Описание | Производитель | PDF |
| 19C300PG9K/L |
Pressure Sensors Low-Cost, Stainless Steel, Isolated Sensors |
Honeywell Solid State Electronics Center |
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| 293D475004A |
Solid Tantalum Surface Mount Chip Capacitors TANTAMOUNT^, Molded Case, Standard Industrial Grade |
Vishay Siliconix |
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| 0014445417 |
2.54mm (.100") Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 22, 0.76lm (30l") Gold (Au), 17 Circuits |
Molex Electronics Ltd. |
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| 1.5KE62 |
TRANSIENT VOLTAGE SUPPRESSOR |
Galaxy Semi-Conductor Holdings Limited |
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| 19C300PG4K/L |
Pressure Sensors Low-Cost, Stainless Steel, Isolated Sensors |
Honeywell Solid State Electronics Center |
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