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| 500592-0800 |
2.50mm (.098") Pitch Wire-to-Wire and Wire-to-Board Housing |
Molex Electronics Ltd. |
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500592-0800 Datasheet
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Постоянная ссылка на эту страницу |
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500592-0800 и другие |
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| Компонент | Описание | Производитель | PDF |
| 360FW015XM08 |
Composite Non-Environmental Backshell |
Glenair, Inc. |
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| 7286R50KT2L.25XX |
7/8 Diameter 10-Turn Wirewound Precision Potentiometer |
Bi technologies |
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| 0014562134 |
2.54mm (.100") Pitch SL Insulation Displacement Connector Assembly, Female, Single Row, Version G, Positive Lock, Wire Size 26, 0.38lm (15l") Gold (Au) |
Molex Electronics Ltd. |
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| AEC-6877-A1M-1010 |
Fanless Embedded Controller With Intel Core i7/i5/Celeron Processor And PCI/PCIe Expansion |
AAEON Technology |
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| 1A3400 |
Fuse Clips for Printed Circuit Boards For ATC, 5mm, 1/4 and 13/32 Diameter Fuses |
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