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| 360US014XMT08 |
Composite Non-Environmental Backshell |
Glenair, Inc. |
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360US014XMT08 Datasheet
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| Компонент | Описание | Производитель | PDF |
| 500B18Z471JV4E |
LOW INDUCTANCE CHIP CAPACITORS |
List of Unclassifed Manufacturers |
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| 9DBL411BGILFT |
Four Output Low Power Differential Fanout Buffer for PCI Express Gen1, Gen2, and QPI |
Integrated Device Technology |
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| 1.5KE7.5A |
TRANSIENT VOLTAGE SUPPRESSOR |
Shanghai Sunrise Electronics |
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| 1.5KE7.5A |
GLASS PASSIVATED JUNCTION TRANSIENT VOLTAGE SUPPRESSOR |
List of Unclassifed Manufacturers |
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| 0014564044 |
2.54mm (.100") Pitch SL Insulation Displacement Connector Assembly, Female,Single Row, Version C, Front Ribs, Wire Size 28, 0.76lm (30l") Gold (Au), 4 Circuits |
Molex Electronics Ltd. |
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